B&R Industrial Automation will exhibit its latest packaging solutions

  • 2021-10-20

B&R Industrial Automation will exhibit its latest packaging solutions at booth S-3179 at PACK EXPO International, November 2-5, 2014 in Chicago’s McCormick Place, where, along with the new co-located Pharma EXPO, over 50,000 packaging professionals will come together. With flexible I/O solutions, modern industrial multi-touch HMIs, modular drive systems and Panel PCs that implement the latest Intel® Atom technology, B&R solutions provide the performance, flexibility and interoperability necessary for advanced packaging machinery automation. B&R utilizes open communication protocols, and modular, standards-based software programming and data handling for control systems that simplify integration and operation.

Free automation company can supply B&R automation I/O module to help user solve their problem.

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x20AI1744 X20BM11 X20AO4622
x20ai4632-1 X20BC0087 8B0C0320HW00.002-1
x20di4371 X20BC8083 8BVP0880HW00.004-1
x20do6322 X20CS1070 X20BM111
x20ps3300 X20A04622 X20BM01
x20bc0083 X20HB2880 X67SM2436
x20ao4632 X20CM0985 X20CP1584
X20AT4222 X20IF1063 X67DM9331L12 / X67DM9331.L12
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X20PS4951 X20BB81 X20DO9321
X20AI4622 X20DO9322 X20BR9300
X20DI9371 X20DC2396 X20AO2622

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